Turck Multiprotocol I/O

TURCK Announces Ultra-Compact Multiprotocol I/O Modules

TURCK presents the first ultra-compact, digital block-I/O modules of the new TBEN-S (Small) series. The fully potted IP67 modules are only 1.25” x 5.6” and allow assembly directly on the machine. With their extended temperature range from -40 °C to +70 °C degrees, the devices are highly versatile. Even with the new compact design every TBEN-S module can be operated without additional gateways in each of the three Ethernet systems PROFINET®, Modbus TCP ™or EtherNet/IP™. Additionally, thanks to TURCK’s multiprotocol technology, the devices recognize the used protocol automatically by listening to the communication during the start-up phase. An integrated switch allows the use of the devices in line topology.

“The release of the digital TBEN-S provides our customers with a flexible solution that can be mounted directly to machine, and at a smaller size than anyone else on the market.” said Product Manager Noah Glenn. “Additionally, the digital TBEN-S is availble in a wide variety of options so customers can have exactly what their application needs.”

The TBEN-S modules are available in five variants: four digital inputs and outputs, eight digital inputs with module diagnostics, eight digital inputs with channel diagnostics, eight digital outputs as well as eight universal digital inputs and outputs. The outputs switch a current of up to 2 A. Each output channel is continuously monitored by the integrated diagnostic system that records all events in the device’s event log. This simplifies troubleshooting and reduces downtimes significantly. The internal web server, which can be used to display diagnostics in plain text, also contributes to this. The web page has been set up following the concept of “Responsive Design” so that a smartphone can also be used for easy diagnosis.